| PART |
Description |
Maker |
| 16190 16190-8 |
THERMAL INTERFACE PAD (MINI)
THERMAL INTERFACE PAD, (MINI)
|
VICOR[Vicor Corporation]
|
| AND8044D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ON Semiconductor
|
| P1BS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P2NR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| TC77-5.0MO TC77 TC77-3.3MC TC77-5.0MOA TC773.3MCTT |
Thermal Sensor with SPI Interface
|
MICROCHIP[Microchip Technology]
|
| MON35W42 |
Hardware Monitoring IC with Thermal Diode Interface
|
Standard Microsystems
|
| TD1-2D00-031 |
Thermal Dispersion Flow/Level/Interface Switch
|
Magnetrol International, Inc.
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| ADT7490 ADT7490ARQZ ADT7490ARQZ-R7 ADT7490ARQZ-REE |
dBCool Remote Thermal Monitor and Fan Controller with PECI Interface
|
ON Semiconductor
|
| ATS-51250R-C1-R0-17 |
Comes preassembled with high performance, phase changing, thermal interface material
|
Advanced Thermal Soluti...
|
| AMRI-1000 |
Mobile Navigation Interface IC for Navigation Pad Module
|
AVAGO TECHNOLOGIES LIMITED
|
| FF300R12KS4P |
62mm C-Serien Modul mit schnellem IGBT2 für hochfrequentes Schalten und bereits aufgetragenem Thermal Interface Material
|
Infineon Technologies A...
|
